DIFFERENCE BETWEEN CHIP AND WAFER IN ELECTRONICS

A chip or integrated circuit is a combination of several electrical parts to form one unit. On the other hand, a wafer refers to small sizes of silicon that are used to produce integrated circuit, which are also used in many wafers. Another name for integrated circuit is microchip. It is the assembly of circuit packages, pathways, transistors, etc, all working together to perform a specific task or a series of tasks. Jack Kilby invented the microchip in 1958 and this has been responsible for the dramatic shrinking that computer technology has experience since then. This makes the chip a very critical part of the modern life.

The microchip is the technology underlying much of modern life. Not just in our home computers, but also in our cars, smartphones, stereo, toaster and any number of other tools are likely to feature microchips. The crux of the matter is that microchips are now practically indispensable to everyday life. The first category is the Analog chips. These help to regulate and increase the strength of the signals received from digital chips. Digital chips, on the other hand, are responsible for doing the core function of processing of binary information. Metaphorically speaking, what we mean is that digital chips form the brain part while the analog chips function as the nervous system. There are different kinds of microchips depending on their functions. On of the most common microchips are the ones used in a Central Processing Unit (CPU). These are known as microprocessors.

What they do is to function as the base for where the integrated circuits are to be produced. These small silicon slices all for the core of any electrical product. Several minerals are deposited and diffused in order to manufacture the microcircuits on the silicon wafers. Electronics trade has been one of the most profitable businesses in the world. It is always on the rise and because of this, manufacturers have to develop newer and smaller microchips for the latest electronic devices.

These smaller microchips are more economical and less expensive than their predecessors. They are also more powerful. The next phase is to make the Metallurgical Grade Silicon more refined. This is done by reacting the Metallurgical Grade Silicon (MG-Si) with Hcl. This will produce TCS. During this phase of the process, all the pollutants such as Fe, Al and B are totally removed. In the next phase, the manufacturers use the crystal growing method to produce product samples using a single crystal orientation.

This is followed by the growth procedure phase. The next and final stage involves using various equipment to cut out the desired features, including shapes, sizes, etc. Wafers are made in different diameters Silicon wafers diameters ranges from 25.4 mm (1 inch) to 300 mm (11.8 inches). Each semiconductor fabrication plant is defined by the diameter of wafers that it is designed or programmed to produce.

Summary

The major difference between microchips and wafers can be seen in how they relate. A wafer actually forms the base of a microchip while a microchip is also entrenched into a wafer. In reality, they are separate entities but they work hand in hand in order to perform the desired tasks in any electronic device.

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There are many procedures involved in changing or turning raw silicon into a crystal substrate. In order to produce the industrial brown Metallurgical Grade Silicon, they manufacture many of the silicon by decreasing the SiO2 with Carbon.